Electronic Components Materials EXPO has ended.

2019/01/18

We exhibited at the 48th NEPCON JAPAN ELECTRONIC COMPONENTS AND MATERIALS EXPO.
We demonstrated a new patented product, so we'll show you how it went.
It's up on the product page.
https://www.denka-e.co.jp/products/detail/238
https://www.denka-e.co.jp/products/detail/239

Our next exhibit will be at the Next Generation Agriculture EXPO in May 2019.